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Expo Logic Partners with the International Microelectronics Assembly and Packaging Society
3/12/2015
The International Microelectronics Assembly and Packaging Society has been the largest society dedicated to the study of microelectronics and electronics packaging technologies since 1996. Through professional education, symposia, workshops, and conferences, the society focuses on the growth and advancement of such studies. iMAPS has partnered with Expo Logic to offer instant badge printing on-site for their attendees.

“By offering badge[on]demand™ for the International Microelectronics Assembly and Packaging Society, we are providing the ability for their attendees to receive their badges instantly on-site,” stated Expo Logic’s Solutions Sales Specialist, Jeff Baker. “We know that our new partnership will benefit iMAPS and their attendees for their upcoming event.”

Since 1980, Expo Logic has offered the fastest, most flexible and comprehensive registration and lead management services in the event and trade show industry. Learn more at www.expologic.com.


Contact:
connect@expologic.com






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